ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,928, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Apparatus and methods for selectively etching silicon o... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,929, issued on April 7, was assigned to Lam Research Corp. (Fremont, Calif.). "Atomic layer etching of molybdenum" was invented by Andreas ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,930, issued on April 7, was assigned to Lam Research Corp. (Fremont, Calif.). "Conformal thermal CVD with controlled film properties and hi... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,931, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,932, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods and structures for improving etch profile of underlying layer... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,933, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor devices and methods of manufacturing the same" was inve... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,934, issued on April 7, was assigned to MIKRO MESA TECHNOLOGY Co. LTD. (Apia, Samoa). "Method of manufacturing structure having multi metal... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,936, issued on April 7, was assigned to DISCO Corp. (Tokyo). "Chip manufacturing method using a laser beam with first and second focused po... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,937, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Epitaxial formation with treatment ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,938, issued on April 7, was assigned to SILTRONIC AG (Munich). "Device for drying semiconductor substrates" was invented by Sebastian Geiss... Read More